Personal Information

Name: Matthijs Padding
Location: Enschede, The Netherlands
Contact: For job offers, contact me via LinkedIn.


Saxion University of Applied Sciences:
Applied Computer Science, BSc – 8.5 GPA, Cum Laude


DynaTron, Embedded Software Engineer, June 2021–Aug 2022

  • Self-made CANopen stack (Master/Slave) on STM32/PIC32
  • Updatable Bootloader on PIC32
  • Protobuf over HTTP protocol implementation
  • Refactored network stack on PIC32 to reduce complexity and increase scalability


Movella, Graduation, Feb 2023–June 2023:

  • Proof-of-concept CI/CD pipelines on Azure DevOps
  • Builds using Docker containers
  • For Firmware (IAR) and Software (Windows/Linux)

Movella, Internship, Aug 2022–Feb 2023:

  • Native self-made USB device stack on STM32
  • Portability to other platforms in mind
  • CDC-ACM (Serial) and Mass Storage (FATFS over SCSI)

DEMCON, Internship, Aug 2020–Jan 2021

  • Communication with a netX90 chip via SPI on a Linux platform (iMX7)
  • EtherCAT Master